Global Multi-sided Printed Circuit Board Market size was valued at US$ 8.73 billion in 2024 and is projected to reach US$ 16.42 billion by 2032, at a CAGR of 9.47% during the forecast period 2025–2032.
Multi-sided PCBs are advanced circuit boards with multiple conductive layers separated by insulating materials, enabling complex circuit designs in compact spaces. Unlike standard double-sided boards, these multilayer PCBs typically range from 4 to 12 layers (with some specialized applications requiring up to 50 layers), offering superior electrical performance and design flexibility. The technology facilitates high-density interconnects (HDI) crucial for modern electronics.
The market growth is primarily driven by increasing demand from 5G infrastructure, automotive electronics, and AI hardware. The global PCB industry, valued at USD 81 billion in 2022 according to semiconductor research data, continues its upward trajectory with China dominating production. Recent advancements in substrate materials and miniaturization techniques are further expanding application possibilities, particularly in wearable devices and IoT components. Key players like TTM Technologies and Unimicron are investing heavily in high-layer-count PCBs to meet emerging technological demands.
Download Your Free Copy of the Sample Report-https://semiconductorinsight.com/download-sample-report/?product_id=103183
MARKET DYNAMICS
MARKET DRIVERS
Proliferation of 5G and IoT Technologies Accelerating PCB Demand
The rapid global rollout of 5G networks is creating unprecedented demand for multi-sided PCBs, particularly in telecommunications infrastructure and connected devices. With 5G requiring significantly more base stations than previous generations – estimated at 3-4 times denser deployment than 4G – the need for high-frequency, high-density circuit boards has surged. These advanced PCBs must handle higher data transfer rates while maintaining signal integrity, pushing manufacturers to develop boards with more layers and superior materials. The Internet of Things (IoT) ecosystem, projected to exceed 29 billion connected devices by 2027, further fuels this demand as smart devices require compact, reliable PCBs for functionality.
Automotive Electronics Evolution Driving PCB Innovation
Modern vehicles are undergoing a technological transformation, evolving into essentially computers on wheels. The average automobile now contains over 1,400 semiconductor chips, many mounted on multi-layer PCBs. Electric vehicles (EVs) in particular require advanced PCB configurations, with the power electronics system alone containing numerous high-current boards. Advanced driver-assistance systems (ADAS), in-vehicle infotainment, and upcoming autonomous driving technologies all rely on sophisticated multi-sided PCBs capable of operating in harsh environments. The automotive PCB market segment is growing at approximately 6-8% annually, outpacing many other application areas.
Recent Developments
- TTM Technologies announced the expansion of its high-density interconnect (HDI) PCB manufacturing capabilities in North America, targeting aerospace and defense applications that require multi-sided designs for compact, high-performance systems.
- AT&S began mass production of advanced multi-layered PCBs for automotive radar modules, driven by the rising demand for ADAS (Advanced Driver Assistance Systems) and autonomous driving technologies.
- Zhen Ding Tech Group unveiled new multi-sided PCB technologies using halogen-free materials aimed at eco-friendly and high-speed digital applications in consumer electronics.
- Samsung Electro-Mechanics partnered with global OEMs to develop 10+ layer PCBs for next-gen smartphones and AI hardware, aiming to optimize space while improving thermal performance.
- Nippon Mektron Ltd. invested in flexible multi-sided PCB innovations to support foldable devices and wearable technology trends in the consumer electronics sector.
MARKET OPPORTUNITIES
Emerging Applications in AI Infrastructure Creating New Demand
The explosive growth of artificial intelligence applications is driving demand for specialized PCBs in data centers and edge computing devices. AI servers require boards capable of handling high-power GPU clusters and high-speed interconnects, with some designs incorporating 20+ layers. The AI hardware market is projected to grow at over 30% CAGR through 2030, representing a significant opportunity for PCB manufacturers capable of meeting these technical requirements. Cloud service providers are working closely with PCB suppliers to develop customized solutions for their AI infrastructure needs.
Advanced Packaging Technologies Opening New Frontiers
The convergence of PCB and semiconductor packaging technologies is creating opportunities for innovation. Technologies like embedded die packaging and chip-first fan-out approaches are blurring the lines between PCBs and packages. Manufacturers investing in these hybrid approaches can capture value in both markets. The global advanced packaging market is expected to surpass $65 billion by 2027, with PCB-like substrates playing an increasingly important role. This trend is particularly significant for high-performance computing, automotive, and medical electronics applications where miniaturization and performance are paramount.
Grab Your Complimentary Sample Report-https://semiconductorinsight.com/download-sample-report/?product_id=103183
List of Key Multi-sided PCB Manufacturers
- Zhen Ding Technology Holding Limited (Taiwan)
- TTM Technologies (U.S.)
- Unimicron Technology Corporation (Taiwan)
- AT&S Austria Technologie & Systemtechnik AG (Austria)
- NOK Corporation (Japan)
- Sumitomo Corporation (Japan)
- Würth Elektronik GmbH & Co. KG (Germany)
- Career Technology (Taiwan)
- Fujikura Ltd. (Japan)
- Nitto Denko Corporation (Japan)
- Jabil Circuit (U.S.)
- Murrietta Circuits (U.S.)
- Advanced Circuits (U.S.)
Segment Analysis:
By Type
Rigid PCBs Dominate the Market Due to Widespread Adoption in High-End Electronic Applications
The market is segmented based on type into:
- Rigid PCBs
- Subtypes: Standard multilayer, HDI, IC substrates
- Flexible PCBs
- Subtypes: Single-sided flex, double-sided flex, multilayer flex, rigid-flex
- High-Frequency PCBs
- Others
By Application
Consumer Electronics Segment Leads Market Growth Fueled by Smart Device Proliferation
The market is segmented based on application into:
- Consumer Electronics
- Automotive
- Aerospace and Defense
- Industrial Electronics
- IT and Telecom
- Others
By Layer Count
4-8 Layer PCBs Hold Significant Market Share Balancing Complexity and Cost-Effectiveness
The market is segmented based on layer count into:
- 4-8 Layer PCBs
- 8-16 Layer PCBs
- 16+ Layer PCBs
- Others
By End User
OEMs Represent the Largest Segment Driving PCB Innovation and Production
The market is segmented based on end user into:
- Original Equipment Manufacturers (OEMs)
- Electronic Manufacturing Services (EMS)
- Fabrication Houses
- Others
Other Topic-Dry Etching Agent Market
CONTACT US:
City vista, 203A, Fountain Road, Ashoka Nagar, Kharadi, Pune, Maharashtra 411014
[+91 8087992013]
help@semiconductorinsight.com
